Publications
Publications by Research Area
Publications by Division
X Author: Ravi S Prasher
2005
Prasher, Ravi S."Planck blackbody emissive power in particulate media."Appl. Phys. Lett.
86 (2005) 071914. DOI
Ganapathy, Deepak, Kulwinder Singh, Patrick E Phelan, and Ravi S Prasher."An Effective Unit Cell Approach to Compute the Thermal Conductivity of Composites With Cylindrical Particles."J. Heat Transfer
127 (2005) 553–559. DOI
Chang, Je-Young, Ravi S Prasher, David Chau, Alan M Myers, John Dirner, Suzana Prstic, and Dongming He."Convective Performance of Package Based Single Phase Microchannel Heat Exchanger."ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
(2005) 183–188. DOI
Prasher, Ravi S, John Dirner, Je-Young Chang, Alan M Myers, David Chau, Suzana Prstic, and Dongming He."Effect of Localized Hotspot on the Thermal Performance of Two-Phase Microchannel Heat Exchanger."ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
(2005) 99–103. DOI
Prasher, Ravi S, and David W Song."Microscopic Effective Medium Model for Thermal Conductivity of Two Dimensional Nano-Porous and Micro-Porous Media."ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems
(2005) 355–358. DOI
Prasher, Ravi S, and Patrick E Phelan."Modeling of Radiative and Optical Behavior of Nanofluids Based on Multiple and Dependent Scattering Theories."ASME 2005 International Mechanical Engineering Congress and Exposition
(2005) 739–743. DOI
Hu, Xuejiao, Ravi S Prasher, and Kenneth E Goodson."Thermal Conduction Phenomena in Advanced Interface Materials for Electronics Cooling."ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems
(2005) 963–966. DOI
Sauciuc, Ioan, Ravi S Prasher, Je-Young Chang, Ravi Mahajan, and C Migliaccio."Bearing life: A future package cooling challenge."
14 (2005).
Chang, J Y, I Santos, J Hermarding, A Dani, Ravi S Prasher, and others others."Some thermal technology and thermal management considerations in the design of next generation Intel Centrino Mobile Technology platforms."Intel Technology Journal
(2005).
Prasher, Ravi S, Prajesh Bhattacharya, and Patrick E Phelan."Thermal conductivity of nanoscale colloidal solutions (nanofluids)."Phys. Rev. Lett.
94 (2005) 025901. DOI
Prasher, Ravi S, Prajesh Bhattacharya, and Patrick E Phelan."Thermal Conductivity of Nanoscale Colloidal Solutions (Nanofluids)."Physical Review Letters
94.025901-1 – 025901-4. (2005).
Prasher, Ravi S, Chia-Pin Chiu, and Himanshu Pokharna."Thermal management arrangement with channels structurally adapted for varying heat flux areas."
(2005).
Sauciuc, Ioan, Ravi S Prasher, Je-Young Chang, Hakan Erturk, Gregory M Chrysler, Chia-Pin Chiu, and Ravi Mahajan."Thermal Performance and Key Challenges for Future CPU Cooling Technologies."ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
(2005) 353–364. DOI
Chang, Je-Young, Unnikrishnan Vadakkan, Ravi S Prasher, and Suzana Prstic."Thermal Performance of Vapor Chambers Under Hot Spot Heating Conditions."ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
(2005) 197–203. DOI
Prasher, Ravi S, John Dirner, Je-Young Chang, Alan M Myers, David Chau, Dongming He, and Suzana Prstic."Thermal Resistance and Pressure Drop of Silicon Based Micro Pin Fin Heat Exchanger Under Cross Flow."ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
(2005) 717–725. DOI
Prasher, Ravi S."Thermal transport due to transverse phonons in nano and micro particulate media."J. Appl. Phys.
97 (2005) 064313. DOI
2004
Bhattacharya, Prajesh, P Vijayan, T Tang, S Nara, Patrick E Phelan, Ravi S Prasher, J Wang, and David W Song."Evaluation of the Temperature Oscillation Technique to Calculate Thermal Conductivity of Water and Systematic Measurement of the Thermal Conductivity of Aluminum Oxide – Water Nanofluiids."International Mechanical Engineering Congress & Exposition,
(2004).
Prasher, Ravi S."Mie scattering theory for phonon transport in particulate media."J. Heat Transfer
(2004). DOI
Prasher, Ravi S."Scattering of Phonons by Nano and Micro Particles."ASME 2004 International Mechanical Engineering Congress and Exposition
(2004) 3–14. DOI
Bhattacharya, Prajesh, S.K Saha, Ajay K Yadav, Patrick E Phelan, and Ravi S Prasher."Brownian Dynamics Simulation to Determine the Effective Thermal Conductivity of Nanofluids."Journal of Applied Physics
95.11 (2004) 6492–6494. DOI
Patterson, M K, Xiaojin Wei, Y Joshi, and Ravi S Prasher."Numerical study of conjugate heat transfer in stacked microchannels."The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543)
1 (2004) 372–380 Vol.1. DOI
Bhattacharya, Prajesh, Patrick E Phelan, and Ravi S Prasher."Determining the Effective Viscosity of a Nanofluid Using Brownian Dynamics Simulation."1st International Symposium on Micro & Nano Technology
(2004).
Kramer, Theresa A, Roger D Flynn, David W Fogg, Evelyn N Wang, Carlos H Hidrovo, Kenneth E Goodson, Ravi S Prasher, David Chau, and Sridhar Narasimhan."Microchannel Experimental Structure for Measuring Temperature Fields During Convective Boiling."ASME 2004 International Mechanical Engineering Congress and Exposition
(2004) 699–705. DOI
Prasher, Ravi S, and J C Matayabas."Thermal contact resistance of cured gel polymeric thermal interface material."IEEE Trans. Compon. Packag. Technol.
27 (2004) 702–709. DOI