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Microelectronic package including thermally conductive sealant between heat spreader and substrate

Publication Type

Patent

Date Published

10/2008

Authors

Gupta, Ashish, Leonel R Arana, David W Song, Chia-Pin Chiu, Ravi S Prasher, Chris Matayabas, Nirupama Chakrapani

Abstract

A microelectronic package. The package includes a substrate; a die mounted onto the substrate; an integrated heat spreader mounted onto the substrate, and thermally coupled to a backside of the die; and a sealant material bonding the integrated heat spreader to the substrate, the sealant material having a bulk thermal conductivity above about 1 W/m/° C. and a modulus of elasticity lower than a modulus of elasticity of solder.

Year of Publication

2008