Micro-thermal-fluid transient analysis and active control for two-phase microelectronics cooling

Publication Type

Conference Paper

Date Published

08/2010

Authors

DOI

Abstract

Because of increasing power densities, microchannel systems are being explored for two-phase cooling of ultra high power electronic devices. Flow instability is a potential problem in any two-phase microchannel cooling system especially for transient applications. With various two-phase flow stabilities possible in a microscale boiling system, the overall cooling performance deteriorates significantly. For better dynamic thermal management of microelectronic systems, a family of oscillatory flow boiling heat transfer correlations and active stabilizing flow control methods have been developed.

Journal

2010 IEEE International Conference on Automation Science and Engineering

Year of Publication

2010

Organization

Research Areas