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Integrated circuit coolant microchannel assembly with targeted channel configuration

Publication Type

Patent

Date Published

08/2007

Authors

Chang, Je-Young, Ioan Sauciuc, Chuan Hu, Chia-Pin Chiu, Gregory M Chrysler, Ravi S Prasher, Rajiv K Mongia, Himanshu Pokharna, Eric Distefano

Abstract

A microchannel structure has microchannels formed therein. The microchannels are to transport a coolant and to be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant. At least one of the microchannels has a length extent and has a first section at a first location along the length extent and a second section at a second location along the length extent. The first section of the microchannel has a first aspect ratio and the second section is divided into at least two sub-channels. Each sub-channel has a respective second aspect ratio that is greater than the first aspect ratio.

Year of Publication

2007