Publications by Research Area
Publications by Division
Lu, Daniel, C.P. Wong, Ravi S. Prasher, and Chia-Pin Chiu."Thermal Interface Materials."Materials for Advanced Packaging (2017) 511 - 535. DOI
Gupta, , Ashish, Leonel R Arana, David W. Song, Chia-Pin Chiu, Ravi S. Prasher, Chris Matayabas, and Nirupama Chakrapani."Microelectronic package including thermally conductive sealant between heat spreader and substrate." (2008).
Chang, Je-Young, Ioan Sauciuc, Chuan Hu, Chia-Pin Chiu, Gregory M . Chrysler, Ravi S. Prasher, Rajiv K Mongia, Himanshu Pokharna, and Eric Distefano."Integrated circuit coolant microchannel assembly with targeted channel configuration." (2007).
Myers, Alan M., Je-Young Chang, Ravi S. Prasher, Ioan Sauciuc, Gregory M . Chrysler, Patrick D Boyd, and Chia-Pin Chiu."Integrated circuit coolant microchannel with compliant cover." (2007).
Torresola, Javier, Chia-Pin Chiu, Gregory M . Chrysler, Dean Grannes, Ravi Mahajan, Ravi S. Prasher, and Abhay A. Watwe."Density factor approach to representing impact of die power maps on thermal management."IEEE Trans. Adv. Packag. 28.4 (2005) 659–664. DOI
Prasher, Ravi S., Chia-Pin Chiu, and Himanshu Pokharna."Thermal management arrangement with channels structurally adapted for varying heat flux areas." (2005).
Sauciuc, Ioan, Ravi S. Prasher, Je-Young Chang, Hakan Erturk, Gregory M . Chrysler, Chia-Pin Chiu, and Ravi Mahajan."Thermal Performance and Key Challenges for Future CPU Cooling Technologies."ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference (2005) 353–364. DOI
Mahajan, Ravi, Chia-Pin Chiu, and Ravi S. Prasher."Thermal interface materials: a brief review of design characteristics and materials."Electronics Cooling (2004).