Surface chemistry and characteristics based model for the thermal contact resistance of fluidic interstitial thermal interface materials
Publication Type
Journal Article
Date Published
02/2001
Author
DOI
Abstract
Microprocessor powers are increasing at a phenomenal rate, which requires very small thermal resistance between the die (chip) and the ambient, if the current economical methods of conduction and convection cooling are to be utilized. A typical thermal solution in …
Journal
J. Heat Transfer
Year of Publication
2001